Wafer testing probe
By adopting the spring probe technology, UIGreen can provide Wafer Level Chip Scale Packaging (WLCSP) probes. Based on high signal integrity and velocity testing capacity, it can provide switchable flexibility in manual and automatic tests.
Material download
Contact technicians
Tel：+86 0512-8717 6308 
Fax：+86 0512-87173536 
Email：Sales@uigreen.com 
Address：No. 80 Emeishan Road/No. 196 Putuoshan Road, Suzhou High-tech Zone, Jiangsu Province