Global Service UIGreen was privileged to conduct in-depth exchanges with numerous industry peers on product-related information and jointly explore the development trends of the semiconductor industry.
At the "2025 ICCAD-Expo Advanced Packaging and Testing (II)" forum, Cai Hongyi, R&D Director of UIGreen's Micro Testing Division, delivered a detailed presentation on the application of UIG Z-series contact in RF chip testing. This presentation demonstrated the company's leading capabilities in testing technology and solutions.
Throughout the exhibition, UIGreen actively engaged with various industry partners and potential clients, discussing the latest technology trends and potential collaboration opportunities. The company's displayed products, including pind and sockets, attracted significant attention.
UIGreen expresses its sincere gratitude to ICCAD-Expo for providing this valuable exchange platform, which facilitated for in-depth communication with industry partners. The company looks forward to collaborating with more industry colleagues at future events to jointly drive the development of the semiconductor industry, and eagerly awaits the next gathering.
