Semiconductor chip package test probe
Z-series probes are suitable for QFN package chip testing, with an interval ranging from 300mm to 800mm. The reliable high-frequency RFSignal integrity and auto-cleaning system can guarantee removal of Sn of Pad so that you can obtain a higher testing yield.
Material download
Contact technicians
Tel：+86 0512-8717 6308 
Fax：+86 0512-87173536 
Email：Sales@uigreen.com 
Address：No. 80 Emeishan Road/No. 196 Putuoshan Road, Suzhou High-tech Zone, Jiangsu Province